Okay guys, things to note:
1. max temp in Prime95/LinX (AVX) vs max temp in AIDA64
difference can be as high as 20C. so talking about max temp without saying what stress tool you use is CONFUSING!
2. safest delid method should be vice only method, it is properly documented in overclockr forum. Personally I dare not use razer/cutter to delid.
3. main reason to delid is the gap between the die and the IHS.
the gap is caused by the silly glue, not the IHS itself. So make sure you clear all those glue residual after delid. If you glue the IHS back, I bet the gap will exist again :) . Again, it is well documented in overclockr forum.
4. Thermal compound between die and IHS - best to use Liquid Ultra
Thermal compound between IHS and heatsink - depends, no aluminium on your heatsink, then Liquid Ultra should be the best. If not, use GC extreme.
5. MSI delid die guard is not a must. |