Intel intends to close two of their Assembly & Test facilities, located in Cavite and Penang. They will also halt production at two other facilities, laying off at least 5,000 people.

The Cavite facility in the Philippines is actually two buildings next to each other, known as CV1 and CV2. CV1 had the capability to handle wafer sizes in 200 and 300mm in its 268,000 square foot clean room, while CV2 could only handle 200mm in its smaller 149,000 sq. ft. clean room. CV1 was built in 1997, while CV2 was built in 1998 and handled mostly flash memory processing, which has been made redundant due to Intel exiting that business line.

The Penang facility in Malaysia consists of three buildings. PG6 and PG7 could only handle 200mm wafers, but PG8 was upgraded in 2005 to handle 300mm wafers. Malaysian operations will continue and consolidate at their Kulim facilities.

After Intel's wafers are produced at a fab, they are sent to Intel's Assembly and Test facilities where each wafer is cut into individual silicon dies, placed within external packages, and tested for functionality.

Intel is consolidating a lot of its Asian Assembly and Testing into its newest facilities in Chengdu, China, and Ho Chi Minh City, Vietnam, due to labor costs and lower demand.

Production will halt at fab 20 in Hillsboro, Oregon. It was built in 1996 to handle 0.13 micron core logic production on a 200mm line, boasting a 140,000 sq. ft. clean room.

Intel will also halt wafer production operations at its D2 facility in Santa Clara, California. Built in 1988, it handled mostly flash and communications chips, as well as cellular and handheld product development. Throughout its twenty year life, D2 saw 0.13 micron and 90nm production, and was upgraded in 2006 to run 65nm on its 200mm line. Intel's headquarters are also located in the City of Santa Clara.

Intel announced that it would be taking a $250 million charge due to fab underutilization on January 15th.

Intel was particularly persistent in pointing out that this is all obsolete production, and does not affect current production at its three Fabs producing at 45nm in Chandler, Arizona; Kiryat Gat, Israel; or in Rio Rancho, New Mexico. It will also not affect the introduction and ramping of their 32nm process.

原帖由 DVD+RW 於 2009-1-23 09:48 發表
今年年底都上 32nm, 今年都好應該 cut 曬 65nm 廠, 上曬 45nm..... 45nm 都出左成年多, 我覺得佢上 45nm 進程太慢添...

原帖由 DVD+RW 於 2009-1-23 09:48 發表
今年年底都上 32nm, 今年都好應該 cut 曬 65nm 廠, 上曬 45nm..... 45nm 都出左成年多, 我覺得佢上 45nm 進程太慢添...

原帖由 DVD+RW 於 2009-1-23 09:48 發表
今年年底都上 32nm, 今年都好應該 cut 曬 65nm 廠, 上曬 45nm..... 45nm 都出左成年多, 我覺得佢上 45nm 進程太慢添...

原帖由 trentcys 於 2009-1-23 11:59 發表


Intel唔只出CPU
佢一直都係用CPU phase out出黎o既舊製程生產chipset同其他晶片...

原帖由 qcmadness 於 2009-1-23 12:27 發表

仲有其他controller  (e.g. raid / SSD), flash memory, legacy chips...

原帖由 qcmadness 於 2009-1-22 17:31 發表
http://www.dailytech.com/Intel+H ... es/article14026.htm

65nm fab closed

原帖由 trentcys 於 2009-1-23 13:55 發表


It's no that bad... Intel still has 2 other 65nm fabs around?

原帖由 trentcys 於 2009-1-23 13:47 發表


Flash memory應該冇得同其他core logic比
製程o既話好似已經超越左CPU. 不過結構又簡單咁多, 有個做得flash o既新製程又唔一定做到core logic

FYI: Intel, Micron go after Samsung with 34 nm fla ...

原帖由 qcmadness 於 2009-1-23 15:40 發表

D1C? and the other?

原帖由 trentcys 於 2009-1-23 16:28 發表


Ireland and Shanghai...
Not sure if any other fabs are making a mix of 65nm &45nm parts. Prehaps no?

原帖由 qcmadness 於 2009-1-23 16:29 發表

45nm: Fab 11x, Fab D1D, Fab 32?

原帖由 trentcys 於 2009-1-23 16:31 發表
I at first suspected fab 32 (that in AZ). But I checked Intel's website and it said it's only making 45nm parts these days.